The evaluation of the numerical methods to study the buckling of stiff films on elastomeric substrates

Ordered buckling of stiff films on elastomeric substrates has many applications in the field of stretchable electronics. Mechanics plays a very important role in such systems. A full three dimensional finite element analysis studying the pattern of wrinkles formed on a stiff film bonded to a compliant substrate under the action of a compressive force has been widely studied. For thin films, this wrinkling pattern is usually sinusoidal, and for wide films the pattern depends on loading conditions. The present study establishes a relationship between the effect of the load applied at an angle to the stiff film. A systematic experimental and analytical study of these systems has been presented in the present study. The study is performed for two different loading conditions, one with the compressive force applied parallel to the film and the other with an angle included between the application of the force and the alignment of the stiff film. A geometric model closely resembling the experimental specimen studied is created and a three dimensional finite element analysis is carried out using ABAQUS (Version 6.7). The objective of the finite element simulations is to validate the results of the experimental study to be corresponding to the minimum total energy of the system. It also helps to establish a relation between the parameters of the buckling profile and the parameters (elastic and dimensional parameters) of the system. Two methods of non-linear analysis namely, the Newton-Raphson method and Arc-Length method are used. It is found that the Arc-Length method is the most cost effective in terms of total simulation time for large models (higher number of elements).The convergence of the results is affected by a variety of factors like the dimensional parameters of the substrate, mesh density of the model, length of the substrate and the film, the angle included. For narrow silicon films the buckling profile is observed to be sinusoidal and perpendicular to the direction of the silicon film. As the angle increases in wider stiff films the buckling profile is seen to transit from being perpendicular to the direction of the film to being perpendicular to the direction of the application of the pre-stress. This study improves and expands the application of the stiff film buckling to an angled loading condition.