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ASU Electronic Theses and Dissertations


This collection includes most of the ASU Theses and Dissertations from 2011 to present. ASU Theses and Dissertations are available in downloadable PDF format; however, a small percentage of items are under embargo. Information about the dissertations/theses includes degree information, committee members, an abstract, supporting data or media.

In addition to the electronic theses found in the ASU Digital Repository, ASU Theses and Dissertations can be found in the ASU Library Catalog.

Dissertations and Theses granted by Arizona State University are archived and made available through a joint effort of the ASU Graduate College and the ASU Libraries. For more information or questions about this collection contact or visit the Digital Repository ETD Library Guide or contact the ASU Graduate College at gradformat@asu.edu.


Contributor
Date Range
2014 2020


In this dissertation, the results of our comprehensive computational studies of disordered jammed (i.e., mechanically stable) packings of hard particles are presented, including the family of superdisks in 2D and ellipsoids in 3D Euclidean space. Following a very brief introduction to the hard-particle systems, the event driven molecular dynamics (EDMD) employed to generate the packing ensembles will be discussed. A large number of 2D packing configurations of superdisks are subsequently analyzed, through which a relatively accurate theoretical scheme for packing-fraction prediction based on local particle contact configurations is proposed and validated via additional numerical simulations. Moreover, the studies on binary …

Contributors
Xu, Yaopengxiao, Jiao, Yang, Oswald, Jay, et al.
Created Date
2014

The study of deflagration to detonation transition (DDT) in explosives is of prime importance with regards to insensitive munitions (IM). Critical damage owing to thermal or shock stimuli could translate to significant loss of life and material. The present study models detonation and deflagration of a commonly used granular explosive: cyclotetramethylene-tetranitramine, HMX. A robust literature review is followed by computational modeling of gas gun and DDT tube test data using the Sandia National Lab three-dimensional multi-material Eulerian hydrocode CTH. This dissertation proposes new computational practices and models that aid in predicting shock stimulus IM response. CTH was first used to …

Contributors
Mahon, Kelly Susan, Lee, Taewoo, Herrmann, Marcus, et al.
Created Date
2015

Dissimilar metal joints such as aluminum-steel joints are extensively used in automobile, naval and aerospace applications and these are subjected to corrosive environmental and mechanical loading resulting in eventual failure of the structural joints. In the case of aluminum alloys under aggressive environment, the damage accumulation is predominantly due to corrosion and is accelerated in presence of other metals. During recent years several approaches have been employed to develop models to assess the metal removal rate in the case of galvanic corrosion. Some of these models are based on empirical methods such as regression analysis while others are based on …

Contributors
Muthegowda, Nitin Chandra, Solanki, Kiran N, Rykaczewski, Konrad, et al.
Created Date
2015

For decades, microelectronics manufacturing has been concerned with failures related to electromigration phenomena in conductors experiencing high current densities. The influence of interconnect microstructure on device failures related to electromigration in BGA and flip chip solder interconnects has become a significant interest with reduced individual solder interconnect volumes. A survey indicates that x-ray computed micro-tomography (µXCT) is an emerging, novel means for characterizing the microstructures' role in governing electromigration failures. This work details the design and construction of a lab-scale µXCT system to characterize electromigration in the Sn-0.7Cu lead-free solder system by leveraging in situ imaging. In order to enhance …

Contributors
Mertens, James Charles Edwin, Chawla, Nikhilesh, Alford, Terry, et al.
Created Date
2015

Fracture phenomena have been extensively studied in the last several decades. Continuum mechanics-based approaches, such as finite element methods and extended finite element methods, are widely used for fracture simulation. One well-known issue of these approaches is the stress singularity resulted from the spatial discontinuity at the crack tip/front. The requirement of guiding criteria for various cracking behaviors, such as initiation, propagation, and branching, also poses some challenges. Comparing to the continuum based formulation, the discrete approaches, such as lattice spring method, discrete element method, and peridynamics, have certain advantages when modeling various fracture problems due to their intrinsic characteristics …

Contributors
Chen, Hailong, Liu, Yongming, Jiao, Yang, et al.
Created Date
2015

Stress corrosion cracking (SCC) is a materials degradation phenomena resulting from a combination of stress and a corrosive environment. Among the alphabet soup of proposed mechanism of SCC the most important are film-rupture, film-induced cleavage and hydrogen embrittlement. This work examines various aspects of film-induced cleavage in gold alloys for which the operation of hydrogen embrittlement processes can be strictly ruled out on thermodynamic grounds. This is so because in such alloys SCC occurs under electrochemical conditions within which water is stable to hydrogen gas evolution. The alloy system examined in this work is AgAu since the corrosion processes in …

Contributors
CHEN, XIYING, Sieradzki, Karl, Jiao, Yang, et al.
Created Date
2016

Mechanical behavior of metallic thin films at room temperature (RT) is relatively well characterized. However, measuring the high temperature mechanical properties of thin films poses several challenges. These include ensuring uniformity in sample temperature and minimizing temporal fluctuations due to ambient heat loss, in addition to difficulties involved in mechanical testing of microscale samples. To address these issues, we designed and analyzed a MEMS-based high temperature tensile testing stage made from single crystal silicon. The freestanding thin film specimens were co-fabricated with the stage to ensure uniaxial loading. Multi-physics simulations of Joule heating, incorporating both radiation and convection heat transfer, …

Contributors
Eswarappa Prameela, Suhas, Rajagopalan, Jagannathan, Wang, Liping, et al.
Created Date
2016

Over the past several years, the density of integrated circuits has been increasing at a very fast rate, following Moore’s law. The advent of three dimensional (3D) packaging technologies enable the increase in density of integrated circuits without necessarily shrinking the dimensions of the device. Under such constraints, the solder volume necessary to join the various layers of the package is also extremely small. At smaller length scales, the local cooling rates are higher, so the microstructures are much finer than that obtained in larger joints (BGA, C4). The fraction of intermetallic compounds (IMCs) present in solder joints in these …

Contributors
Kirubanandham, Antony, Chawla, Nikhilesh, Jiao, Yang, et al.
Created Date
2016

Nanocrystalline (NC) materials experience inherent microstructural instability when exposed to elevated temperature, deformation rates or loads over long periods of time which limits its applications as well as processing. The instability arises due to the predominance of grain boundary (GB) diffusional processes which hastens coarsening. This dissertation aims to provide a solution for the very first time, through the development and characterization of a bulk NC alloy system. The NC-Cu-Ta discussed here offers exceptional thermal stability in addition to superior strength and creep resistance. The systematic study of the behavior of this material will pave the way for future development …

Contributors
Rajagopalan, Mansa, Solanki, Kiran N., Alford, Terry L., et al.
Created Date
2016

Electromigration (EM) has been a serious reliability concern in microelectronics packaging for close to half a century now. Whenever the challenges of EM are overcome newer complications arise such as the demand for better performance due to increased miniaturization of semiconductor devices or the problems faced due to undesirable properties of lead-free solders. The motivation for the work is that there exists no fully computational modeling study on EM damage in lead-free solders (and also in lead-based solders). Modeling techniques such as one developed here can give new insights on effects of different grain features and offer high flexibility in …

Contributors
Karunakaran, Deepak, Karunakaran, Deepak, Jiao, Yang, et al.
Created Date
2016