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ASU Electronic Theses and Dissertations


This collection includes most of the ASU Theses and Dissertations from 2011 to present. ASU Theses and Dissertations are available in downloadable PDF format; however, a small percentage of items are under embargo. Information about the dissertations/theses includes degree information, committee members, an abstract, supporting data or media.

In addition to the electronic theses found in the ASU Digital Repository, ASU Theses and Dissertations can be found in the ASU Library Catalog.

Dissertations and Theses granted by Arizona State University are archived and made available through a joint effort of the ASU Graduate College and the ASU Libraries. For more information or questions about this collection contact or visit the Digital Repository ETD Library Guide or contact the ASU Graduate College at gradformat@asu.edu.


Language
  • English
Date Range
2014 2019


In this dissertation, the results of our comprehensive computational studies of disordered jammed (i.e., mechanically stable) packings of hard particles are presented, including the family of superdisks in 2D and ellipsoids in 3D Euclidean space. Following a very brief introduction to the hard-particle systems, the event driven molecular dynamics (EDMD) employed to generate the packing ensembles will be discussed. A large number of 2D packing configurations of superdisks are subsequently analyzed, through which a relatively accurate theoretical scheme for packing-fraction prediction based on local particle contact configurations is proposed and validated via additional numerical simulations. Moreover, the studies on binary …

Contributors
Xu, Yaopengxiao, Jiao, Yang, Oswald, Jay, et al.
Created Date
2014

For decades, microelectronics manufacturing has been concerned with failures related to electromigration phenomena in conductors experiencing high current densities. The influence of interconnect microstructure on device failures related to electromigration in BGA and flip chip solder interconnects has become a significant interest with reduced individual solder interconnect volumes. A survey indicates that x-ray computed micro-tomography (µXCT) is an emerging, novel means for characterizing the microstructures' role in governing electromigration failures. This work details the design and construction of a lab-scale µXCT system to characterize electromigration in the Sn-0.7Cu lead-free solder system by leveraging in situ imaging. In order to enhance …

Contributors
Mertens, James Charles Edwin, Chawla, Nikhilesh, Alford, Terry, et al.
Created Date
2015

Fracture phenomena have been extensively studied in the last several decades. Continuum mechanics-based approaches, such as finite element methods and extended finite element methods, are widely used for fracture simulation. One well-known issue of these approaches is the stress singularity resulted from the spatial discontinuity at the crack tip/front. The requirement of guiding criteria for various cracking behaviors, such as initiation, propagation, and branching, also poses some challenges. Comparing to the continuum based formulation, the discrete approaches, such as lattice spring method, discrete element method, and peridynamics, have certain advantages when modeling various fracture problems due to their intrinsic characteristics …

Contributors
Chen, Hailong, Liu, Yongming, Jiao, Yang, et al.
Created Date
2015

Dissimilar metal joints such as aluminum-steel joints are extensively used in automobile, naval and aerospace applications and these are subjected to corrosive environmental and mechanical loading resulting in eventual failure of the structural joints. In the case of aluminum alloys under aggressive environment, the damage accumulation is predominantly due to corrosion and is accelerated in presence of other metals. During recent years several approaches have been employed to develop models to assess the metal removal rate in the case of galvanic corrosion. Some of these models are based on empirical methods such as regression analysis while others are based on …

Contributors
Muthegowda, Nitin Chandra, Solanki, Kiran N, Rykaczewski, Konrad, et al.
Created Date
2015

The study of deflagration to detonation transition (DDT) in explosives is of prime importance with regards to insensitive munitions (IM). Critical damage owing to thermal or shock stimuli could translate to significant loss of life and material. The present study models detonation and deflagration of a commonly used granular explosive: cyclotetramethylene-tetranitramine, HMX. A robust literature review is followed by computational modeling of gas gun and DDT tube test data using the Sandia National Lab three-dimensional multi-material Eulerian hydrocode CTH. This dissertation proposes new computational practices and models that aid in predicting shock stimulus IM response. CTH was first used to …

Contributors
Mahon, Kelly Susan, Lee, Taewoo, Herrmann, Marcus, et al.
Created Date
2015

Mechanical behavior of metallic thin films at room temperature (RT) is relatively well characterized. However, measuring the high temperature mechanical properties of thin films poses several challenges. These include ensuring uniformity in sample temperature and minimizing temporal fluctuations due to ambient heat loss, in addition to difficulties involved in mechanical testing of microscale samples. To address these issues, we designed and analyzed a MEMS-based high temperature tensile testing stage made from single crystal silicon. The freestanding thin film specimens were co-fabricated with the stage to ensure uniaxial loading. Multi-physics simulations of Joule heating, incorporating both radiation and convection heat transfer, …

Contributors
Eswarappa Prameela, Suhas, Rajagopalan, Jagannathan, Wang, Liping, et al.
Created Date
2016

Stress corrosion cracking (SCC) is a materials degradation phenomena resulting from a combination of stress and a corrosive environment. Among the alphabet soup of proposed mechanism of SCC the most important are film-rupture, film-induced cleavage and hydrogen embrittlement. This work examines various aspects of film-induced cleavage in gold alloys for which the operation of hydrogen embrittlement processes can be strictly ruled out on thermodynamic grounds. This is so because in such alloys SCC occurs under electrochemical conditions within which water is stable to hydrogen gas evolution. The alloy system examined in this work is AgAu since the corrosion processes in …

Contributors
CHEN, XIYING, Sieradzki, Karl, Jiao, Yang, et al.
Created Date
2016

Improved knowledge connecting the chemistry, structure, and properties of polymers is necessary to develop advanced materials in a materials-by-design approach. Molecular dynamics (MD) simulations can provide tremendous insight into how the fine details of chemistry, molecular architecture, and microstructure affect many physical properties; however, they face well-known restrictions in their applicable temporal and spatial scales. These limitations have motivated the development of computationally-efficient, coarse-grained methods to investigate how microstructural details affect thermophysical properties. In this dissertation, I summarize my research work in structure-based coarse-graining methods to establish the link between molecular-scale structure and macroscopic properties of two different polymers. Systematically …

Contributors
Agrawal, Vipin, Oswald, Jay, Peralta, Pedro, et al.
Created Date
2016

An integrated experimental and numerical investigation for laser-generated optoacoustic wave propagation in structural materials is performed. First, a multi-physics simulation model is proposed to simulate the pulsed laser as a point heat source which hits the surface of an aluminum sheet. The pulsed laser source can generate a localized heating on the surface of the plate and induce an in-plane stress wave. ANSYS – a finite element analysis software – is used to build the 3D model and a coupled thermal-mechanical simulation is performed in which the heat flux is determined by an empirical laser-heat conversion relationship. The displacement and …

Contributors
Liu, Chen, Liu, Yongming, Wang, Liping, et al.
Created Date
2016

Electromigration (EM) has been a serious reliability concern in microelectronics packaging for close to half a century now. Whenever the challenges of EM are overcome newer complications arise such as the demand for better performance due to increased miniaturization of semiconductor devices or the problems faced due to undesirable properties of lead-free solders. The motivation for the work is that there exists no fully computational modeling study on EM damage in lead-free solders (and also in lead-based solders). Modeling techniques such as one developed here can give new insights on effects of different grain features and offer high flexibility in …

Contributors
Karunakaran, Deepak, Karunakaran, Deepak, Jiao, Yang, et al.
Created Date
2016