ASU Electronic Theses and Dissertations
- 1 Public
Pb-free solders are used as interconnects in various levels of micro-electronic packaging. Reliability of these interconnects is very critical for the performance of the package. One of the main factors affecting the reliability of solder joints is the presence of porosity which is introduced during processing of the joints. In this thesis, the effect of such porosity on the deformation behavior and eventual failure of the joints is studied using Finite Element (FE) modeling technique. A 3D model obtained by reconstruction of x-ray tomographic image data is used as input for FE analysis to simulate shear deformation and eventual failure …
- Jakkali, Vaidehi, Chawla, Nikhilesh K, Jiang, Hanqing, et al.
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