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ASU Electronic Theses and Dissertations


This collection includes most of the ASU Theses and Dissertations from 2011 to present. ASU Theses and Dissertations are available in downloadable PDF format; however, a small percentage of items are under embargo. Information about the dissertations/theses includes degree information, committee members, an abstract, supporting data or media.

In addition to the electronic theses found in the ASU Digital Repository, ASU Theses and Dissertations can be found in the ASU Library Catalog.

Dissertations and Theses granted by Arizona State University are archived and made available through a joint effort of the ASU Graduate College and the ASU Libraries. For more information or questions about this collection contact or visit the Digital Repository ETD Library Guide or contact the ASU Graduate College at gradformat@asu.edu.


Bayesian networks are powerful tools in system reliability assessment due to their flexibility in modeling the reliability structure of complex systems. This dissertation develops Bayesian network models for system reliability analysis through the use of Bayesian inference techniques. Bayesian networks generalize fault trees by allowing components and subsystems to be related by conditional probabilities instead of deterministic relationships; thus, they provide analytical advantages to the situation when the failure structure is not well understood, especially during the product design stage. In order to tackle this problem, one needs to utilize auxiliary information such as the reliability information from similar products …

Contributors
Yontay, Petek, Pan, Rong, Montgomery, Douglas C, et al.
Created Date
2016

This thesis presents a meta-analysis of lead-free solder reliability. The qualitative analyses of the failure modes of lead- free solder under different stress tests including drop test, bend test, thermal test and vibration test are discussed. The main cause of failure of lead- free solder is fatigue crack, and the speed of propagation of the initial crack could differ from different test conditions and different solder materials. A quantitative analysis about the fatigue behavior of SAC lead-free solder under thermal preconditioning process is conducted. This thesis presents a method of making prediction of failure life of solder alloy by building …

Contributors
Xu, Xinyue, Pan, Rong, Montgomery, Douglas, et al.
Created Date
2014