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ASU Electronic Theses and Dissertations


This collection includes most of the ASU Theses and Dissertations from 2011 to present. ASU Theses and Dissertations are available in downloadable PDF format; however, a small percentage of items are under embargo. Information about the dissertations/theses includes degree information, committee members, an abstract, supporting data or media.

In addition to the electronic theses found in the ASU Digital Repository, ASU Theses and Dissertations can be found in the ASU Library Catalog.

Dissertations and Theses granted by Arizona State University are archived and made available through a joint effort of the ASU Graduate College and the ASU Libraries. For more information or questions about this collection contact or visit the Digital Repository ETD Library Guide or contact the ASU Graduate College at gradformat@asu.edu.


The microstructure development of Inconel alloy 718 (IN718) during conventional processing has been extensively studied and much has been discovered as to the mechanisms behind the exceptional creep resistance that the alloy exhibits. More recently with the development of large scale 3D printing of alloys such as IN718 a new dimension of complexity has emerged in the understanding of alloy microstructure development, hence, potential alloy development opportunity for IN718. This study is a broad stroke at discovering possible alternate microstructures developing in Direct-Metal-Laser-Sintering (DMLS) processed IN718 compared to those in conventional wrought IN718. The main inspiration for this study came …

Contributors
Rogers, Blake Kenton, Tasooji, Amaneh, Petuskey, William, et al.
Created Date
2017

Microelectronic industry is continuously moving in a trend requiring smaller and smaller devices and reduced form factors with time, resulting in new challenges. Reduction in device and interconnect solder bump sizes has led to increased current density in these small solders. Higher level of electromigration occurring due to increased current density is of great concern affecting the reliability of the entire microelectronics systems. This paper reviews electromigration in Pb- free solders, focusing specifically on Sn0.7wt.% Cu solder joints. Effect of texture, grain orientation, and grain-boundary misorientation angle on electromigration and intermetallic compound (IMC) formation is studied through EBSD analysis performed …

Contributors
Lara, Leticia, Tasooji, Amaneh, Lee, Kyuoh, et al.
Created Date
2013

Ball Grid Array (BGA) using lead-free or lead-rich solder materials are widely used as Second Level Interconnects (SLI) in mounting packaged components to the printed circuit board (PCB). The reliability of these solder joints is of significant importance to the performance of microelectronics components and systems. Product design/form-factor, solder material, manufacturing process, use condition, as well as, the inherent variabilities present in the system, greatly influence product reliability. Accurate reliability analysis requires an integrated approach to concurrently account for all these factors and their synergistic effects. Such an integrated and robust methodology can be used in design and development of …

Contributors
Fallah-Adl, Ali, Tasooji, Amaneh, Krause, Stephen, et al.
Created Date
2013

This thesis discusses the evolution of conduction mechanism in the silver (Ag) on zinc oxide (ZnO) thin film system with respect to the Ag morphology. As a plausible substitute for indium tin oxide (ITO), TCO/Metal/TCO (TMT) structure has received a lot of attentions as a prospective ITO substitute due to its low resistivity and desirable transmittance. However, the detailed conduction mechanism is not fully understood. In an attempt to investigate the conduction mechanism of the ZnO/Ag/ZnO thin film system with respect to the Ag microstructure, the top ZnO layer is removed, which offers a better view of Ag morphology by …

Contributors
Zhang, Shengke, Alford, Terry L, Schroder, Dieter K, et al.
Created Date
2012