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Ab initio Study of Tantalum Nitride and Silver Adatoms


Abstract In 2022, integrated circuit interconnects will approach 10 nm and the diffusion barrier layers needed to ensure long lasting devices will be at 1 nm. This dimension means the interconnect will be dominated by the interface and it has been shown the interface is currently eroding device performance. The standard interconnect system has three layers - a Copper metal core, a Tantalum Adhesion layer and a Tantalum Nitride Diffusion Barrier Layer. An alternate interconnect schema is a Tantalum Nitride barrier layer and Silver as a metal. The adhesion layer is removed from the system along with changing to an alternate, low resistivity metal. First principles are used to assess the interface of the Silver and Tantalum Nitride. Several stoichiomet... (more)
Created Date 2012
Contributor Grumski, Michael (Author) / Adams, James (Advisor) / Krause, Stephen (Committee member) / Alford, Terry (Committee member) / Arizona State University (Publisher)
Subject Materials Science / Physics / Quantum physics / Density Functional Theory / Interconnect / Silver Adatom / Silver Interface / Tantalum Nitride
Type Doctoral Dissertation
Extent 106 pages
Language English
Copyright
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Note Ph.D. Materials Science and Engineering 2012
Collaborating Institutions Graduate College / ASU Library
Additional Formats MODS / OAI Dublin Core / RIS


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Description Dissertation/Thesis