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Development of a Robust and Integrated Methodology for Predicting the Reliability of Microelectronic Packaging Systems

Abstract Ball Grid Array (BGA) using lead-free or lead-rich solder materials are widely used as Second Level Interconnects (SLI) in mounting packaged components to the printed circuit board (PCB). The reliability of these solder joints is of significant importance to the performance of microelectronics components and systems. Product design/form-factor, solder material, manufacturing process, use condition, as well as, the inherent variabilities present in the system, greatly influence product reliability. Accurate reliability analysis requires an integrated approach to concurrently account for all these factors and their synergistic effects. Such an integrated and robust methodology can be used in design and development of new and advanced microele... (more)
Created Date 2013
Contributor Fallah-Adl, Ali (Author) / Tasooji, Amaneh (Advisor) / Krause, Stephen (Committee member) / Alford, Terry (Committee member) / Jiang, Hanqing (Committee member) / Mahajan, Ravi (Committee member) / Arizona State University (Publisher)
Subject Materials Science / Engineering
Type Doctoral Dissertation
Extent 225 pages
Language English
Reuse Permissions All Rights Reserved
Note Ph.D. Materials Science and Engineering 2013
Collaborating Institutions Graduate College / ASU Library
Additional Formats MODS / OAI Dublin Core / RIS

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Description Dissertation/Thesis