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Needleless Electrospinning Experimental Study and Nanofiber Application in Semiconductor Packaging

Abstract ABSTRACT Electronics especially mobile electronics such as smart phones, tablet PCs, notebooks and digital cameras are undergoing rapid development nowadays and have thoroughly changed our lives. With the requirement of more transistors, higher power, smaller size, lighter weight and even bendability, thermal management of these devices became one of the key challenges. Compared to active heat management system, heat pipe, which is a passive fluidic system, is considered promising to solve this problem. However, traditional heat pipes have size, weight and capillary limitation. Thus new type of heat pipe with smaller size, lighter weight and higher capillary pressure is needed. Nanofiber has been proved with superior properties and has been... (more)
Created Date 2014
Contributor Sun, Tianwei (Author) / Jiang, Hanqing (Advisor) / Yu, Hongyu (Committee member) / Chen, Kangping (Committee member) / Arizona State University (Publisher)
Subject Mechanical engineering / Packaging / Materials Science / Heat pipe / Nanofiber / Needleless electrospinning / Wick structure
Type Masters Thesis
Extent 63 pages
Language English
Reuse Permissions All Rights Reserved
Note M.S. Mechanical Engineering 2014
Collaborating Institutions Graduate College / ASU Library
Additional Formats MODS / OAI Dublin Core / RIS

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Description Dissertation/Thesis