Skip to main content

Applied Meta-Analysis of Lead-Free Solder Reliability

Abstract This thesis presents a meta-analysis of lead-free solder reliability. The qualitative analyses of the failure modes of lead- free solder under different stress tests including drop test, bend test, thermal test and vibration test are discussed. The main cause of failure of lead- free solder is fatigue crack, and the speed of propagation of the initial crack could differ from different test conditions and different solder materials. A quantitative analysis about the fatigue behavior of SAC lead-free solder under thermal preconditioning process is conducted. This thesis presents a method of making prediction of failure life of solder alloy by building a Weibull regression model. The failure life of solder on circuit board is assumed Weibull d... (more)
Created Date 2014
Contributor Xu, Xinyue (Author) / Pan, Rong (Advisor) / Montgomery, Douglas (Committee member) / Wu, Teresa (Committee member) / Arizona State University (Publisher)
Subject Industrial engineering / Statistics / Bayesian inference / Lead-free solder / Markov Chain Monte Carlo / Meta-analysis / Reliability / Weibull regression
Type Masters Thesis
Extent 59 pages
Language English
Reuse Permissions All Rights Reserved
Note Masters Thesis Industrial Engineering 2014
Collaborating Institutions Graduate College / ASU Library
Additional Formats MODS / OAI Dublin Core / RIS

  Full Text
487.0 KB application/pdf
Download Count: 1917

Description Dissertation/Thesis