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Highly Sensitive in-Plane Strain Mapping Using a Laser Scanning Technique

Abstract In this work, a highly sensitive strain sensing technique is developed to realize in-plane strain mapping for microelectronic packages or emerging flexible or foldable devices, where mechanical or thermal strain is a major concern that could affect the performance of the working devices or even lead to the failure of the devices. Therefore strain sensing techniques to create a contour of the strain distribution is desired.

The developed highly sensitive micro-strain sensing technique differs from the existing strain mapping techniques, such as digital image correlation (DIC)/micro-Moiré techniques, in terms of working mechanism, by filling a technology gap that requires high spatial resolution while simultaneously maintaining a large fiel... (more)
Created Date 2014
Contributor Liang, Hanshuang (Author) / Yu, Hongbin (Advisor) / Poon, Poh Chieh Benny (Committee member) / Jiang, Hanqing (Committee member) / Zhang, Yong-Hang (Committee member) / Arizona State University (Publisher)
Subject Electrical engineering / Packaging / Diffraction / Grating / Laser / Sensor / Strain mapping
Type Doctoral Dissertation
Extent 101 pages
Language English
Reuse Permissions All Rights Reserved
Note Doctoral Dissertation Electrical Engineering 2014
Collaborating Institutions Graduate College / ASU Library
Additional Formats MODS / OAI Dublin Core / RIS

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Description Dissertation/Thesis