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Bulk Laser Material Modification: Towards a Kerfless Laser Wafering Process

Abstract Due to the ever increasing relevance of finer machining control as well as necessary reduction in material waste by large area semiconductor device manufacturers, a novel bulk laser machining method was investigated. Because the cost of silicon and sapphire substrates are limiting to the reduction in cost of devices in both the light emitting diode (LED) and solar industries, and the present substrate wafering process results in >50% waste, the need for an improved ingot wafering technique exists.

The focus of this work is the design and understanding of a novel semiconductor wafering technique that utilizes the nonlinear absorption properties of band-gapped materials to achieve bulk (subsurface) morphological changes in matter us... (more)
Created Date 2015
Contributor LeBeau, James (Author) / Bowden, Stuart (Advisor) / Honsberg, Christiana (Committee member) / Bertoni, Mariana (Committee member) / Cotter, Jeffrey (Committee member) / Arizona State University (Publisher)
Subject Electrical engineering / Materials Science / Physics / Laser / Multiphoton absorption / Optics / Sapphire / Wafering
Type Doctoral Dissertation
Extent 142 pages
Language English
Reuse Permissions All Rights Reserved
Note Doctoral Dissertation Electrical Engineering 2015
Collaborating Institutions Graduate College / ASU Library
Additional Formats MODS / OAI Dublin Core / RIS

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Description Dissertation/Thesis