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3D Modeling of Void Nucleation and Initial Void Growth due to Tin Diffusion as a Result of Electromigration in Polycrystalline Lead-Free Solders

Abstract Electromigration (EM) has been a serious reliability concern in microelectronics packaging for close to half a century now. Whenever the challenges of EM are overcome newer complications arise such as the demand for better performance due to increased miniaturization of semiconductor devices or the problems faced due to undesirable properties of lead-free solders. The motivation for the work is that there exists no fully computational modeling study on EM damage in lead-free solders (and also in lead-based solders). Modeling techniques such as one developed here can give new insights on effects of different grain features and offer high flexibility in varying parameters and study the corresponding effects. In this work, a new computational ... (more)
Created Date 2016
Contributor Karunakaran, Deepak (Author) / Karunakaran, Deepak (Advisor) / Jiao, Yang (Committee member) / Chawla, Nikhilesh (Committee member) / Rajagopalan, Jagannathan (Committee member) / Arizona State University (Publisher)
Subject Materials Science
Type Masters Thesis
Extent 48 pages
Language English
Reuse Permissions All Rights Reserved
Note Masters Thesis Materials Science and Engineering 2016
Collaborating Institutions Graduate College / ASU Library
Additional Formats MODS / OAI Dublin Core / RIS

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Description Dissertation/Thesis