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4D Microstructural Characterization of Electromigration and Thermal Aging Damage in Tin-Rich Solder Joints


Abstract As the microelectronics industry continues to decrease the size of solder joints, each joint will have to carry a greater current density, making atom diffusion due to current flow, electromigration (EM), a problem of ever-increasing severity. The rate of EM damage depends on current density, operating temperature, and the original microstructure of the solder joint, including void volume, grain orientation, and grain size. While numerous studies have investigated the post-mortem effects of EM and have tested a range of current densities and temperatures, none have been able to analyze how the same joint evolves from its initial to final microstructure. This thesis focuses on the study of EM, thermal aging, and thermal cycling in Sn-rich so... (more)
Created Date 2019
Contributor Branch Kelly, Marion (Author) / Chawla, Nikhilesh (Advisor) / Ankit, Kumar (Committee member) / Antoniswamy, Aravindha (Committee member) / Arizona State University (Publisher)
Subject Materials Science / Engineering / EBSD / Electromigration / Intermetallic growth / lead-free solder / microtomography / Void growth
Type Doctoral Dissertation
Extent 148 pages
Language English
Copyright
Note Doctoral Dissertation Materials Science and Engineering 2019
Collaborating Institutions Graduate College / ASU Library
Additional Formats MODS / OAI Dublin Core / RIS


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Description Dissertation/Thesis