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Thermo-Mechanical Analysis of Temporary Bonding Systems for Flexible Microelectronics Fabrication Applications

Abstract Temporary bonding-debonding of flexible plastic substrates to rigid carriers may facilitate effective substrate handling by automated tools for manufacture of flexible microelectronics. The primary challenges in implementing practical temporary bond-debond technology originate from the stress that is developed during high temperature processing predominately through thermal-mechanical property mismatches between carrier, adhesive and substrate. These stresses are relaxed through bowing of the bonded system (substrate-adhesive-carrier), which causes wafer handling problems, or through delamination of substrate from rigid carrier. Another challenge inherent to flexible plastic substrates and linked to stress is their dimensional instability, ... (more)
Created Date 2011
Contributor Haq, Jesmin (Author) / Raupp, Gregory B (Advisor) / Vogt, Bryan D (Advisor) / Dai, Lenore (Committee member) / Loy, Douglas (Committee member) / Li, Jian (Committee member) / Arizona State University (Publisher)
Subject Chemical Engineering / Adhesive / Bond-Debond / Flexible Microelectronics / Plastic Substrate / Rheology / Thermo-mechanical
Type Doctoral Dissertation
Extent 177 pages
Language English
Reuse Permissions All Rights Reserved
Note Ph.D. Chemical Engineering 2011
Collaborating Institutions Graduate College / ASU Library
Additional Formats MODS / OAI Dublin Core / RIS

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Description Dissertation/Thesis