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Multiscale Modeling of Mechanical Shock Behavior of Environmentally-Benign Lead-Free Solders in Electronic Packaging

Abstract With the increasing focus on developing environmentally benign electronic packages, lead-free solder alloys have received a great deal of attention. Mishandling of packages, during manufacture, assembly, or by the user may cause failure of solder joint. A fundamental understanding of the behavior of lead-free solders under mechanical shock conditions is lacking. Reliable experimental and numerical analysis of lead-free solder joints in the intermediate strain rate regime need to be investigated. This dissertation mainly focuses on exploring the mechanical shock behavior of lead-free tin-rich solder alloys via multiscale modeling and numerical simulations. First, the macroscopic stress/strain behaviors of three bulk lead-free tin-rich solde... (more)
Created Date 2011
Contributor Fei, Huiyang (Author) / Jiang, Hanqing (Advisor) / Chawla, Nikhilesh (Advisor) / Tasooji, Amaneh (Committee member) / Mobasher, Barzin (Committee member) / Rajan, Subramaniam (Committee member) / Arizona State University (Publisher)
Subject Mechanical Engineering / Materials Science / Electrical Engineering / Interfacial law / Intermetallic / Lead-free solder / Mechanical shock / Microstructural fracture / Random defects
Type Doctoral Dissertation
Extent 181 pages
Language English
Reuse Permissions All Rights Reserved
Note Ph.D. Mechanical Engineering 2011
Collaborating Institutions Graduate College / ASU Library
Additional Formats MODS / OAI Dublin Core / RIS

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Description Dissertation/Thesis